LED WHITE DIFFUSED CHIP SMD HSMW-CL25 0.25mm White Leadframe-Based Surface Mount ChipLED
Advantages :
• High package thermal dissipation capability due to the superior package leadframe design
• Small footprint to overcome space count
• Low thickness to overcome space constrains
• Short lead times and competitive pricing
Description :
The HSMW-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMW-CL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the
part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size.
The target applications are Keypad backlighting, Push button backlighting and Status indicators.
The target markets are Mobile Handsets, Communications,Office Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity.
Features :
• Small size top firing
• Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package
• Diffused optics
• Compatible with IR Reflow
• High brightness using InGaN die technology
• Available in 8mm Tape on 7” (178 mm) Diameter Reels
Absolute Maximum Ratings :
for product datasheet, CONTACT US directly.
