Product Categories

SMD Ceramic Capacitor

[246]

Multilayer Ceramic Capacitor

[80]

Ceramic Chip Capacitor

[84]

Ceramic Disc Capacitor

[26]

Tantalum Electrolytic Capacitor

[162]

Polypropylene Film Capacitor

[28]

Aluminum Electrolytic Capacitor

[22]

Integrated Circuit Chips

[132]

Mosfet Power Transistor

[52]

SMD Chip Resistor

[32]

SMD Chip Inductor

[22]

Integrated Circuit Switch

[119]

SMD Fuse Kit

[17]

Electronic Integrated Circuits

[122]

Graphene Supercapacitor

[22]

Contact Now

Shenzhen Weitaixu Capacitor Co.,Ltd

City:shenzhen

Province/State:guangdong

Country/Region:china

Contact Person:MissShea Wang

View Contact Details

Contact Now

MLCC Multilayer Ceramic Chip Capacitors GRM31CC81E226ME11 22uF 25V X6S 20% Pad SMD 1206

Name: MLCC Multilayer Ceramic Chip Capacitors GRM31CC81E226ME11 22uF 25V X6S 20 Pad SMD 1206
Brand: Murata
Price: 1 USD

Ask Latest Price

Brand Name :Murata

Model Number :GRM31CC81E226ME11

Certification :Original Part

Place of Origin :Shenzhen, China

MOQ :6000PCS/Reel

Price :Contact us for Latest Pricing

Payment Terms :T/T, Western Union, Paypal, Wechat Pay

Supply Ability :1000 Reels per Week

Delivery Time :2~5 Working Days (Subjected to availability of Stock)

Packaging Details :6000PCS/Reel, 330mm Reel Plastic Tape W8P4

Capacitance :22uF

Tolerance :±20%

Rated Voltage :25V

Operating Temperature :-55°C ~ 105°C

Packing :6000PCS/Reel, 330mm Reel Plastic Tape W8P4

Temperature Coefficient :X6S(EIA)

Product Type :MLCC Multilayer Ceramic Capacitor

Size :1206

Description :22uF 25V X6S 20% 1206 105°C

Contact Now

Add to Cart

View Product Description

GRM31CC81E226ME11 Cap Ceramic 22uF 25V X6S 20% Pad SMD 1206 105°C T/R MLCC Multilayer Ceramic Capacitor Multi Layer Chip Capacitors

Standard Technical Specifications :

Capacitance: 22000000PF(pF)

Tolerance (+ or -): 20%

Operating Temp Range: -55C to 105C

Rad Hardened: No

Packaging: Tape and Reel

Product Length (mm): 3.2(mm)

Product Depth (mm): 1.6(mm)

Voltage: 25VDC

Package/Case: 1206

Product Height (mm): 1.6(mm)

Temp Coeff (Dielectric): X6S

Number of Terminals: 2

Case Style: Ceramic Chip

Product Diameter (mm): Not Required(mm)

Failure Rate: Not Required

Wire Form: Not Required

Seated Plane Height: Not Required(mm)

Lead Diameter (nom): Not Required(mm)

Construction: SMT Chip

Termination Style: PAD

Technology: STANDARD

Microwave Application: NO

Mounting Style: Surface Mount

Characteristic Data Chart :

for product datasheet, CONTACT US directly.

Inquiry Cart 0